WSD3023DN56 N-Ch and P-Channel 30V/-30V 14A/-12A DFN5*6-8 WINSOK MOSFET

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WSD3023DN56 N-Ch and P-Channel 30V/-30V 14A/-12A DFN5*6-8 WINSOK MOSFET

short description:


  • Model Number: WSD3023DN56
  • BVDSS: 30V/-30V
  • RDSON: 14mΩ/23mΩ
  • ID: 14A/-12A
  • Channel: N-Ch and P-Channel
  • Package: DFN5*6-8
  • Product Summery: The voltage of WSD3023DN56 MOSFET is 30V/-30V, the current is14A/-12A, the resistance is 14mΩ/23mΩ, the channel is N-Ch and P-Channel, and the package is DFN5*6-8.
  • Applications: Drones, motors, automotive electronics, major appliances.
  • Product Detail

    Application

    Product Tags

    General Description

    The WSD3023DN56 is the highest performance trench N-ch and P-ch MOSFETs with extreme high cell density ,which provide excellent RDSON and gate charge for most of the synchronous buck converter applications . The WSD3023DN56 meet the RoHS and Green Product requirement 100% EAS guaranteed with full function reliability approved.

    Features

    Advanced high cell density Trench technology ,Super Low Gate Charge ,Excellent CdV/dt effect decline ,100% EAS Guaranteed ,Green Device Available.

    Applications

    High Frequency Point-of-Load Synchronous Buck Converter for MB/NB/UMPC/VGA,Networking DC-DC Power System ,CCFL Back-light Inverter,Drones, motors, automotive electronics, major appliances.

    corresponding material number

    PANJIT PJQ5606

    Important parameters

    Symbol Parameter Rating Units
    N-Ch P-Ch
    VDS Drain-Source Voltage 30 -30 V
    VGS Gate-Source Voltage ±20 ±20 V
    ID Continuous Drain Current, VGS(NP)=10V,Ta=25℃ 14* -12 A
    Continuous Drain Current, VGS(NP)=10V,Ta=70℃ 7.6 -9.7 A
    IDP a Pulse Drain Current Tested, VGS(NP)=10V 48 -48 A
    EAS c Avalanche Energy, Single pulse , L=0.5mH 20 20 mJ
    IAS c Avalanche Current, Single pulse , L=0.5mH 9 -9 A
    PD Total Power Dissipation, Ta=25℃ 5.25 5.25 W
    TSTG Storage Temperature Range -55 to 175 -55 to 175
    TJ Operating Junction Temperature Range 175 175
    RqJA b Thermal Resistance-Junction to Ambient,Steady State 60 60 ℃/W
    RqJC Thermal Resistance-Junction to Case,Steady State 6.25 6.25 ℃/W
    Symbol Parameter Conditions Min. Typ. Max. Unit
    BVDSS Drain-Source Breakdown Voltage VGS=0V , ID=250uA 30 --- --- V
    RDS(ON)d Static Drain-Source On-Resistance VGS=10V , ID=8A --- 14 18.5
    VGS=4.5V , ID=5A --- 17 25
    VGS(th) Gate Threshold Voltage VGS=VDS , ID =250uA 1.3 1.8 2.3 V
    IDSS Drain-Source Leakage Current VDS=20V , VGS=0V , TJ=25℃ --- --- 1 uA
    VDS=20V , VGS=0V , TJ=85℃ --- --- 30
    IGSS Gate-Source Leakage Current VGS=±20V , VDS=0V --- --- ±100 nA
    Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz --- 1.7 3.4 Ω
    Qge Total Gate Charge VDS=15V, VGS=4.5V, IDS=8A --- 5.2 --- nC
    Qgse Gate-Source Charge --- 1.0 ---
    Qgde Gate-Drain Charge --- 2.8 ---
    Td(on)e Turn-On Delay Time VDD=15V,RL=15R, IDS=1A,VGEN=10V, RG=6R. --- 6 --- ns
    Tre Rise Time --- 8.6 ---
    Td(off)e Turn-Off Delay Time --- 16 ---
    Tfe Fall Time --- 3.6 ---
    Cisse Input Capacitance VDS=15V , VGS=0V , f=1MHz --- 545 --- pF
    Cosse Output Capacitance --- 95 ---
    Crsse Reverse Transfer Capacitance --- 55 ---

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