Power MOSFET packages are designed to optimize thermal performance, electrical conductivity, and mounting convenience. Each package type offers unique advantages for specific applications.
Through-Hole Packages
TO-220
- Industry standard package
- Excellent thermal performance
- Up to 75A current rating
- Easy heatsink mounting
TO-247
- Higher power handling
- Superior thermal performance
- Up to 100A current rating
- Larger die size capability
Surface Mount Packages
D2PAK (TO-263)
┌────────────┐ │ ┌────────┐ │ │ │ │ │ │ └────────┘ │ └┬─┬─┬─┬─┬──┘ │ │ │ │ │
- SMD version of TO-220
- Excellent thermal performance
- Up to 40A current rating
- Automated assembly compatible
DPAK (TO-252)
┌──────────┐ │ ┌──────┐ │ │ │ │ │ │ └──────┘ │ └┬─┬─┬────┘ │ │ │
- Compact SMD package
- Good thermal performance
- Up to 25A current rating
- Space-efficient design
Package Selection Criteria
- Power dissipation requirements
- PCB space constraints
- Assembly method (manual vs. automated)
- Thermal management needs
- Cost considerations
Advanced Package Types
DirectFET®
Top View ┌──────────┐ │╔════════╗│ │║ ║│ │║ Can ║│ │╚════════╝│ └──────────┘
- Ultra-low package resistance
- Dual-sided cooling
- Optimized current distribution
- Compact footprint
LFPAK (Power-SO8)
┌────────┐ │███████░│ │███████░│ └┬┬┬┬┬┬┬┬┘ 1 2 3 4
- Automotive qualified
- Excellent reliability
- Enhanced thermal performance
- Clip bonding technology
Package Comparison Matrix
| Package Type | Current Rating | Thermal Resistance | Mounting | Size (mm) |
|---|---|---|---|---|
| TO-220 | 50-75A | 1.5°C/W | Through-hole | 10.2 x 15.0 |
| TO-247 | 75-100A | 1.0°C/W | Through-hole | 15.9 x 20.0 |
| D2PAK | 30-40A | 2.0°C/W | Surface | 10.2 x 15.0 |
| DPAK | 15-25A | 3.0°C/W | Surface | 6.5 x 10.0 |
Application-Specific Selection Guide
Automotive
- LFPAK
- TO-220
- D2PAK
Industrial
- TO-247
- TO-220
- DirectFET
Consumer
- DPAK
- PowerSOT
- SO-8
Thermal Considerations
Thermal Path Diagram
Junction
↓
Die Attach
↓
Package
↙ ↘
Heatsink PCB
Typical thermal flow path in power MOSFET packages
Thermal Management Solutions
- Integrated heat spreaders
- Enhanced copper areas
- Thermal vias arrangement
- Advanced die attach materials
Future Trends
Emerging Package Technologies
- Copper clip bonding
- Double-sided cooling packages
- Integrated current sensing
- Stacked-die packages
Design Recommendations
PCB Layout Considerations ┌────────────────┐ │ ╔════════╗ │ │ ║Package ║ │ │ ╚════════╝ │ │ Thermal Vias │ └────────────────┘
- Maximize copper areas
- Optimize thermal via patterns
- Consider airflow direction
- Plan for heatsink attachment
Package Selection Checklist
- Maximum current requirement
- Voltage rating needed
- Thermal requirements
- Board space constraints
- Assembly process compatibility
- Environmental conditions
- Cost targets
- Regulatory requirements
