MOSFET type and construction

Post Time: May-31-2024

Along with the continuous development of science and technology, electronic equipment design engineers must continue to follow the footsteps of intelligent science and technology, to choose more suitable electronic components for the goods, in order to make the goods more in line with the requirements of the times. In which the MOSFET is the basic components of electronic device manufacturing, and therefore want to select the appropriate MOSFET is more important to grasp its characteristics and a variety of indicators.

In the MOSFET model selection method, from the structure of the form (N-type or P-type), operating voltage, power switching performance, packaging elements and its well-known brands, to cope with the use of different products, the requirements are followed by different, we will actually explain the following MOSFET packaging.

After the MOSFET chip is made, it must be encapsulated before it can be applied. To put it bluntly, packaging is to add a MOSFET chip case, this case has a support point, maintenance, cooling effect, and at the same time also give protection for the chip grounding and protection, easy to MOSFET components and other components to form a detailed power supply circuit.

Output power MOSFET package has inserted and surface mount test two categories. Insertion is the MOSFET pin through the PCB mounting holes soldering soldering on the PCB. Surface mount is the MOSFET pins and heat exclusion method of soldering on the surface of the PCB welding layer.

Chip raw materials, processing technology is a key element of the performance and quality of MOSFETs, the importance of improving the performance of MOSFETs manufacturing manufacturers will be in the core structure of the chip, the relative density and its processing technology level to carry out improvements, and this technical improvement will be invested in a very high cost fee. Packaging technology will have a direct impact on the chip's various performance and quality, the face of the same chip needs to be packaged in a different way, do so can also enhance the performance of the chip.